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2010年

・ Effect of Heat Treatment on the Hardness of Ti-Mo-N Films Deposited by RF Reactive Magnetron Sputtering
　S. Komiyama, Y. Sutou and J. Koike
　Materials Transaction, 51(8) (2010) 1467-1473

・ Selective Formation of a SnO2 Cap Layer, Its Growth Behavior, and Oxidation Resistance
　Yoshito Fujii, Junichi Koike, Yuji Sutou, Zifeng Li and Koji Neishi
　Japanese Journal of Applied Physics, 49 (2010) 05FA02-1-4

・ Effects of Water Desorption from SiO2 Substrates on the Thickness of Manganese Oxide Diffusion Barrier Layer Formed by Chemical Vapor Deposition
　Kenji Matsumoto, Koji Neishi, Hitoshi Itoh, Hidenori Miyoshi, Hiroshi Sato, Shigetoshi Hosaka and Junichi Koike
　Japanese Journal of Applied Physics, 49 (2010) 05FA12-1-2

・ Roles of deformation twinning and dislocation slip in the fatigue failure mechanism of AZ31 Mg alloys
　J. Koike, N. Fujiyama, D. Ando and Y. Sutou
　Scripta Materialia, 63 (2010) 747-750

・ Cu Alloy TFT Electrodes for Advanced Displays
　J. Koike, K. Hirota, P. Yun and Y. Sutou
　The proceedings of AM-FPD '10, (2010) 89-91

・ Electrical Properties and Microstructure of Cu-Mn Electrodes on Amorphous In-Ga-Zn-O Semiconductors
　Pilsang Yun and Junichi Koike
　The proceedings of AM-FPD '10, (2010) 45-48

・ Relationship between deformation twinning and surface step formation in AZ31 magnesium alloys
D. Ando, J. Koike and Y. Sutou
Acta Materialia, 58 (2010) 4316-4324

・ Crystallization behavior of Ge1Cu2Te3 amorphous film
　Y. Sutou, T. Kamada, Y. Saito, M. Sumiya and J. Koike
　2010 Materials Research Society Symposium Proceedings, 1251 (2010) H05-08

・ Electrical Resistance Change with Crystallization in Si-Te Amorphous Thin Films
　Y. Saito, Y. Sutou and J. Koike
　2010 Materials Research Society Symposium Proceedings, 1251 (2010) H06-07

・ Ti-Mo-N反応性スパッタ薄膜の硬さに及ぼす熱処理の効果
　小宮山翔子、須藤祐司、小池淳一
　日本金属学会誌, 74 (2010) 135-141

・ The Relationship between Grain Boundary Sliding and Anisotropic Dislocation Plasticity in AZ31 Magnesium Alloys at Room Temperature
　 D. Ando, Y. Sutou and J. Koike
　Magnesium Technology, (2010) 245-247

・ Graded composition and valence states in self-forming barrier layers at Cu-Mn/SiO2 interface
　Y. Otsuka, J. Koike, H. Sako, K. Ishibashi, N. Kawasaki, S. M. Chung and I. Tanaka
　Applied Physics Letters, 96 (2010) 012101-1-012101-3

2009年

・ The Microstructure and Mechanical Properties of Ti-Mo-N Coating Films
　S. Komiyama, Y. Sutou and J. Koike
　Proc. PFAM XVIII, 4 (2009) 2007-2016

・ Optimization of source-drain process with Cu-Mn alloys
　J. Koike, M. Sano, K. Hirota, Y. Sutou and K. Neishi
　Proc. Internaional Display Workshop 2009, (2009)

・ Selective formation of a SnO2 cap layer, its growth behavior and oxidation resistance
　Y. Fujii, J. Koike, Y. Sutou and K. Neishi
　Proc. Advanced Metallization Conference, (2009) 118-119

・ Effect of water desorption from dielectric substrates on the thickness of CVD-MnOx diffusion barrier layer
　K. Matsumoto, K. Neishi, H. Itoh, H. Miyoshi, H. Sato, S. Hosaka and J. Koike
　Proc. Advanced Metallization Conference, (2009) 114-115

・ Thin MnO barrier formation with CVD for Cu contact plug on nickel silicide
　K. Neishi, T. Sagawa, Y. Sutou and J. Koike
　Proc. Advanced Metallization Conference, (2009) 3-4

・ Electrical resistance and structural changes on crystallization process of amorphous Ge-Te thin films
　Y. Saito, Y. Sutou and J. Koike
　Proc. 2009 MRS Spring Meeting, (2009) 143-148

・ Electronic Transport Properties of Cu/MnOx/SiO2/p-Si MOS Devices
　V. K. Dixit, K. Neishi and J. Koike
　Proc. 2009 MRS Spring Meeting, (2009) 105-109

・ Adhesion and Cu diffusion barrier properties of a MnOx barrier layer formed with thermal MOCVD
　K. Neishi, D. Vijay, S. Aki, J. Koike, K. Matsumoto, H. Sato, H. Itoh and S. Hosaka
　Proc. 2009 MRS Spring Meeting, (2009) 99-104

・ CVD法による先端LSI-Cu配線用MnOxバリア層形成と信頼性評価
　根石浩司、V. K. Dixit、松本賢治、伊藤仁、佐藤浩、保坂重敏、小池淳一
　LSIにおける原子輸送・応力問題第14回研究会予稿集, (2009) 29-32

・ マグネシウム合金の室温変形機構 -変形双晶に注目して-
　小池淳一
　軽金属, 59 (2009) 272-277

・ Influence of moisture on the CVD formation of a MnOx barrier layer
　Neishi K, Matsumoto K, Sato H, Itoh H, Hosaka S, Koike J
　Proc. Advanced Metallization Conference, (2009) 307-311

・ Deposition Behavior and Diffusion Barrier Property of CVD MnOx
　Matsumoto K, Neishi K, Itoh H, Sato H, Hosaka S, Koike J
　Proc. of the 2009 IEEE International Interconnect Technology Conference, (2009) 197-199

・ Analysis of dielectric constant of a self-forming barrier layer with Cu-Mn alloy on TEOS-SiO2
　Chung SM, Koike J
　Journal of Vaccum Science & Technology B, 27 (2009) L28-L31

・ The Role of Deformation Twin during Fracture Behavior in AZ31
　D. Ando and J. Koike
　Magnesium, 8th International Conference on Magnesium Alloys their Applications 8, (2009) 538-543

・ Microstructural Investigation of Twins Under the Fracture Surface in AZ31 Magnesium Alloys
　D. Ando and J. Koike
　Proc. TMS, Magnesium Technology, (2009) 537-540

・ Resistivity reduction by external oxidation Cu-Mn alloy films for semiconductor interconnect application
　J. Iijima, Y. Fujii, K. Neishi and Junichi Koike
　Journal of Vacuum Science & Technology B, 27(4) (2009) 1963-1968

・ Chemical Vapor Deposition of Mn and Mn Oxide and their Step Coverage and Diffusion Barrier Properties on Patterned Interconnect Structures
　Kenji Matsumoto, Koji Neishi, Hitoshi Itoh, Hiroshi Sato, Shigetoshi Hosaka and Junichi Koike
　Applied Physics Express, 2 (2009) 036503

・ Phase formation and growth kinetics of an interface layer in Ni/SiC
　Kenichiro Terui, Atsuko Sekiguchi, Hiroshi Yoshizaki and Junichi Koike
　Materials Science Forum, 600-603 (2009) 631-634

2008年

・ Formation of Mn Oxide with Thermal CVD and its Diffusion Barrier Property Between Cu and SiO2
　Koji Neishi, Shiro Aki, Jun Iijima and Junichi Koike
　Proc. 2008 MRS Spring Meeting, 1079 (2008) N-03-11

・ Effects of Plasma Surface Treatment on the Self-forming Barrier Process in Porus SiOCH
　Seung-Min Chung, Junichi Koike and Zsolt Tokei
　Proc. 2008 MRS Spring Meeting, 1079 (2008) N-03-10

・ Selective Oxidation and Resistivity Reduction of Cu-Mn Alloy Films for Self-forming Barrier Process
　Jun Iijima, Yoshito Fujii, Koji Neishi and Junichi Koike
　Proc. 2008 MRS Spring Meeting, 1079 (2008) N-03-09

・ Possibilities and problems of self-forming barrier process for advanced LSI metallization
　Koike J, Iijima J, Neishi K
　Advanced Metallization Conference, (2008) 3-9

・ Finite element method analysis of nanoscratch test for the evaluation of interface adhesion strength in Cu thin films on Si substrate
　A. Sekiguchi and J. Koike
　Japanese Jounal of Applied Physics, 47(1) (2008) 249-256

・ Evaluation of interface adhesion strength in Cu/(Ta-x%N,Ta/TaN)/SiO2/Si by nanoscratch test
　A. Sekiguchi and J. Koike
　Japanese Journal of Applied Physics, 47(2) (2008) 1042-1049

・ Formation of a manganese oxide barrier layer with thermal chemical vapor deposition for advanced large-scale integrated interconnect structure
　K. Neishi, S. Aki, K. Matsumoto, H. Sato, H. Itoh, S. Hosaka and J. Koike
　Applied Physics Letters, 93 (2008) 032106

・ Stress relaxation during isothermal annealing in electroplated Cu films
　Soo-Jung Hwang, Young-Chang Joo and Junichi Koike
　Thin Solid Films, 516 (2008) 7588-7594

・ Origin of the Anomalous {1012} Twinning during Tensile Deformation of Mg Alloy Sheet
　Koike J, Sato Y, Ando D
　MATERIALS TRANSACTIONS, 49 (2008) 2792

2007年

・ AZ31マグネシウム合金における変形誘起表面起伏と二重双晶の関係
　安藤大輔、小池淳一
　日本金属学会誌、71(9) (2007) 684-687

・ Relationship between deformation-induced surface relief and double twinning AZ31 magnesium alloy
　D. Ando and J. Koike
　JOUNAL OF THE JAPAN INSTITUTE OF METALS, 71 (2007) 684

・ Growth behavior of self-formed barrier at Cu-Mn/SiO2 interface at 250-450 ℃
　M. Haneda, J. Iijima and J. Koike
　Applied Physics Letters, 90 (2007) 252107

・ Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn/SiO2 interface
　J. Koike, M. Haneda, J. Iijima, K. Neishi et al.
　Journal of Applied Physics, 102 (2007) 043527

・ The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films
　T. Miyamura and J. Koike
　Materials Science and Engineering A, 620 (2007) 445-446

・ 配線信頼性における界面密着性の役割
　小池淳一、貝沼亮介、関口貴子、飯島純、根石浩司
　表面科学、28(2) (2007) 67-71

2006年

・ Growth behavior of self-formed barrier using Cu-Mn alloys at 350 to 600 ℃
　J. Iijima, M. Haneda, J. Koike
　Proc. of the IEEE 2006 International Interconnect Technology Conference, (2006)

・ Cu alloy metallization for self-formed barrier process
　J. Koike, M. Haneda, J. Iijima and M. Wada
　Proc. of the IEEE 2006 International Interconnect Technology Conference, (2006)

・ Highly reliable copper dual-damascene interconnects with self-formed MnSixOy barrier layer
　T. Usui, H. Nasu, S. Takahashi, N. Shimizu, Y. Yoshimaru, H. Shibata and J. Koike
　IEEE Transactions on Electron Devices, 53(10) (2006) 2492-2499

2005年

・ Low Resistive and Highly Reliable Cu Dual-Damascene Interconnect Technology Using Self-Formed MnSixOy Barrier Layer
　T. Usui, H. Nasu, J. Koike, M. Wada, S. Takahashi, N. Shimizu, T. Nishikawa, M. Yoshimaru and H. Shibata
　Proc. of the IEEE 2005 International Interconnect Technology Conference, (2005) 188-190

・ Geometrical criterion for the activation of prismatic slip in AZ61 Mg alloy sheets deformed at room temperature
　J. Koike, R. Ohyama
　Acta Materialia, 53 (2005) 1963

・ Enhanced deformation mechanisms by anisotropic plasticity in polycrystalline Mg alloys at room temperature
　J. Koike
　Metall. Trans. A-Phys. Metall. Mater. Sci., 36A (2005) 1689

・ Evolution of stress-induced surface damage and stress-relaxation of electroplated Cu films at elevated temperatures
　S. J. Hwang, J. Koike and Y. C. Joo
　Materials Science Forum, 475-479 (2005) 3641-3646

・ Self-forming diffusion barrier layer in Cu-Mn alloy metallization
　J. Koike, M. Wada
　Applied Physics Letters, 87 (2005) 041911

2004年

・ Dislocation plasticity and complementary deformation mechanisms in polycrystalline Mg alloys
　J. Koike
　Designing, Processing and Properties of Advanced Engineering Materials, PTS1 and 2 Materials Science Forum, 449-4 (2004) 665

・ Mechanical Processes of Nanoscratch Test for the Measurement of Interface Adhesion Strength
　A. Sekiguchi and J. Koike
　Fatigue and Fracture of Engineering Materials, (2004)

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